Description: 8″ – 3M™ 3762LMQ Low-Melt Glue Sticks
Features:
• 165 PER CASE
• Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.• Excellent “hot-tack” when dispensed at low-melt temperatures.
Can bond expanded polystyrene, corrugated packaging and displays.
25 second bonding range.
FDA listed.
Reviews
There are no reviews yet.